Electronic device

ABSTRACT

A display assembly for an electronic device can include a printed circuit board, a display panel, and a support structure affixed to the display panel and disposed between the display panel and the printed circuit board.

FIELD

The described embodiments relate generally to electronic devices. Moreparticularly, the present embodiments relate to electronic deviceshaving a display.

BACKGROUND

Electronic devices are increasingly being designed with deviceportability in mind, for example, to allow users to use these devices ina wide variety of situations and environments. In the context ofwearable devices, these devices can be designed to include manydifferent functionalities and to be operated in many different locationsand environments. The components of an electronic device, for example,the processors, memory, antennas, display, and other components canpartially determine a level of performance of the electronic device.Further, the arrangement of these components with respect to one anotherin the device can also determine the level of performance of theelectronic device.

Continued advances in electronic devices and their components haveenabled considerable increases in performance. Existing components andstructures for electronic devices can, however, limit the levels ofperformance of such devices. For example, while some components canachieve high levels of performance in some situations, the inclusion ofmultiple components in devices sized to enhance portability can limitthe performance of the components, and thus, the performance of thedevice. Consequently, further tailoring and arrangement of componentsfor electronic devices to provide additional or enhanced functionality,without introducing or increasing undesirable device properties, can bedesirable.

SUMMARY

According to some aspects of the present disclosure a display assemblyfor an electronic device can include a printed circuit board, a displaypanel, and a support structure affixed to the display panel and disposedbetween the display panel and the printed circuit board. The displaypanel can be electrically coupled to the printed circuit board. Thesupport structure can have an electrically conductive element.

In some examples, the electrically conductive element can be part of anantenna. The printed circuit board can be a first printed circuit boardand the support structure can be a second printed circuit board. Thesupport structure can include glass and the electrically conductiveelements can include metallic traces. The display panel and the printedcircuit board can be displaced by a distance of less than about 300microns. The display panel can include either an organic light-emittingdiode (OLED) or a micro light emitting diode (LEDs). The electricallyconductive element can be electrically coupled to the display panel orthe printed circuit board. In some examples, the display assembly caninclude a polyester-based film disposed between the display panel andthe support structure. The polyester-based film can have a thickness ofless than about 50 microns. In some examples, the display assembly caninclude a ferrite layer disposed between the printed circuit board andthe support structure.

According to some aspects, a display assembly for an electronic devicecan include a printed circuit board, a display panel, and a supportstructure disposed between the printed circuit board and the displaypanel. The display panel can be electrically coupled to the printedcircuit board. The printed circuit board can be displaced from thedisplay panel a distance of less than about 300 microns.

In some examples, the support structure can have a thickness of lessthan about 50 microns. In some examples, the display assembly caninclude an intermediate layer disposed between the printed circuit boardand the support structure, the intermediate layer including ferrite. Thedisplay assembly can have a thickness of less than about 800 microns.The support structure can include a woven glass reinforced epoxy resin.In some examples, the display assembly can include an electricallyconductive trace formed within the support structure or on a surface ofthe support structure.

According to some aspects, a display assembly for an electronic devicecan include a printed circuit board, a display panel, a supportstructure, and an electrical coupler conductively connecting the printedcircuit board and the support structure. The display panel can beelectrically coupled to the printed circuit board. The support structurecan be disposed between the printed circuit board and the display panel.

In some examples, the electrical coupler can include a proximal end, adistal end, and an intermediate portion extending between the proximalend and the distal end. The proximal end can be conductively connectedto the printed circuit board. The distal end can be displaced from theproximal end and conductively connected to the support structure.

In some examples, the electrical coupler can include a body and a flangeextending laterally from the body. The body can define a channelextending through the body. The body can extend through an apertureformed within the printed circuit board. In some examples, solder can bedisposed within the channel of the body to electrically attach theelectrical coupler to the support structure.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1A shows a perspective view of an electronic device.

FIG. 1B shows an exploded view of an electronic device.

FIG. 2 shows an exploded view of a display assembly.

FIG. 3 shows a side view of a display assembly.

FIG. 4 shows an exploded view of a display assembly.

FIG. 5A shows a top perspective view of a display assembly in a firstconfiguration.

FIG. 5B shows a bottom perspective view of a display assembly in asecond configuration.

FIG. 6A shows a top perspective view of an electrical coupler.

FIG. 6B shows a cross-sectional side view of the electrical coupler ofFIG. 6A.

FIG. 7A shows a top perspective view of an electrical coupler.

FIG. 7B shows a cross-sectional side view of the electrical coupler ofFIG. 7A.

FIG. 7C shows a top view of a support structure.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments, as defined by theappended claims.

The architecture and components of the electronic devices describedherein can allow for configurations and designs that can maximize theavailable space or volume in an internal volume defined by a housing ofthe device that is available to be occupied by one or more components.For example, certain aspects of device performance, such as batterylife, can be improved by increasing the size or volume of the battery ofthe device. Additionally, or alternatively, the device itself could bereduced in size while achieving similar or even improved levels ofperformance.

In addition to saving space or providing other useful or desirablefeatures, the architectures and components described herein can alsoreduce an overall thickness of a display assembly within the device.Accordingly, the devices and components described herein can includeconfigurations and features that allow for the optimization andimprovement of the performance of one or more antennas contained in sucha device. For example, it can be desirable for one or more componentswithin the display assembly (e.g., a display panel) to act as both anoperational component as well as an antenna radiating element. However,one or more radiating components within the display assembly can causeother components within the display assembly to capacitively couple(i.e., effectively forming a capacitor). Capacitive coupling betweencomponents of the display assembly can induce losses in antennaperformance. By reducing a gap or distance between the capacitivelycoupled components of the display assembly, losses in antennaperformance resultant from capacitive coupling within the displayassembly can be mitigated.

In some examples, a display assembly for an electronic device caninclude a printed circuit board, a display panel, and a supportstructure affixed to the display panel and disposed between the displaypanel and the printed circuit board. The display panel can beelectrically coupled to the printed circuit board. The support structurecan provide a rigid structural support for the display panel and alsoinclude an electrically conductive element to provide a secondaryfunctionality. A single layer with multiple functionalities can reduce aquantity of intermediate layers required within the display assembly andthereby reduce the gap or distance between the printed circuit board andthe display panel. By reducing a gap or distance between thecapacitively coupled display panel and printed circuit board, losses inantenna performance resultant from capacitive coupling within thedisplay assembly can be mitigated.

These and other embodiments are discussed below with reference to FIGS.1A-7C. However, the detailed description given herein with respect tothese Figures is for explanatory purposes only and should not beconstrued as limiting. Furthermore, as used herein, a system, a method,an article, a component, a feature, or a sub-feature including at leastone of a first option, a second option, or a third option should beunderstood as referring to a system, a method, an article, a component,a feature, or a sub-feature that can include one of each listed option(e.g., only one of the first option, only one of the second option, oronly one of the third option), multiple of a single listed option (e.g.,two or more of the first option), two options simultaneously (e.g., oneof the first option and one of the second option), or combinationthereof (e.g., two of the first option and one of the second option).

FIG. 1A shows an example of an electronic device 100. The electronicdevice shown in FIG. 1A is a watch, such as a smartwatch. The smartwatchof FIG. 1A is merely one representative example of a device that can beused in conjunction with the systems and methods disclosed herein.Electronic device 100 can correspond to any form of wearable electronicdevice, a portable media player, a media storage device, a portabledigital assistant (“PDA”), a tablet computer, a computer, a mobilecommunication device, a GPS unit, a remote control device, or otherelectronic device. The electronic device 100 can be referred to as anelectronic device, or a consumer device. In some examples, theelectronic device 100 can include a housing 102 that can carryoperational components, for example, in an internal volume at leastpartially defined by the housing. The electronic device 100 can alsoinclude a strap 104, or other retaining component that can secured thedevice 100 to a body of a user as desired. Further details of theelectronic device are provided below with reference to FIG. 1B.

FIG. 1B illustrates an exploded view of the electronic device 100including the housing 102, a display module 106, and a back cover 108.Together, the housing 102, the display module 106, and the back cover108 can define an exterior surface and an internal volume of the device100. The housing 102 can be a substantially continuous or unitarycomponent, and can define one or more openings 110, 112 to receivecomponents of the electronic device 100 and/or to provide access to aninternal portion of the electronic device 100. In some examples, thedevice 100 can include input components such as one or more buttons 114and/or a crown 116 that can be disposed in the openings 110, 112.

The display module 106 can be received by and can be attached to thehousing 102. The display module 106 can include a cover 118 including atransparent material, such as plastic, glass, and/or ceramic. Thedisplay module 106 can also include a display stack or display assembly120 that can include multiple layers and components, each of which canperform one or more desired functions. For example, the display assembly120 can include a touch detection layer or component, a force sensitivelayer or component, and one or more display panels or components thatcan include one or more pixels and/or light emitting portions to displayvisual content and/or information to a user. In some examples, one ormore of the layers can include a liquid crystal display (LCD), a lightemitting diode (LED) display, an organic light emitting diode (OLED)display, and/or any other form of display. The display assembly 120 canalso include one or more electrical connectors to provide signals and/orpower to the display panel from other components of the display module106 or the device 100. The display assembly 120 will be discussed ingreater detail herein with reference to FIGS. 2-5B.

In some examples, the device 100 can include a gasket or seal 122 thatcan be disposed between the display assembly 120 and the housing 102 tosubstantially define a barrier to the ingress of liquids or moistureinto the internal volume from the external environment at the locationof the seal 122. As described herein, the seal 122 can include polymer,metal, and/or ceramic materials.

The device 100 can also include internal components, such as a hapticengine 124, a battery 126, an audio module 128, and a logic board 130,also referred to as a main logic board 130 that can include a system inpackage (SiP) disposed thereon, including one or more integratedcircuits, such as processors, sensors, and memory. The SiP can alsoinclude a package.

In some examples, the device 100 can include one or more wirelessantennas that can be in electrical communication with one or more othercomponents of the device 100. In some examples, one or more antennas canreceive and/or transmit wireless signals at one or more frequencies andcan be, for example, one or more of a cellular antenna such as an LTEantenna, a Wi-Fi antenna, a Bluetooth antenna, a Global PositioningSystem (GPS) antenna, an Near Field Communication (NFC) antenna, amulti-frequency antenna, an Ultra-Wideband (UWB) antenna, and the like.The antenna or antennas can be communicatively coupled to one or moreadditional components of the electronic device 100. In some examples,one or more other components of the device 100 can include a portion orpart of an antenna, such as a radiating element thereof. For example,one or more antenna coils can be disposed within the display module 106such that a component of the display module (e.g., a display panel) canradiate electromagnetic waves generated by the antenna.

The internal components can be disposed within the internal volumedefined at least partially by the housing 102, and can be affixed to thehousing 102 via adhesives, internal surfaces, attachment features,threaded connectors, studs, posts, or other features, that are formedinto, defined by, or otherwise part of the housing 102 and/or the cover118 and/or back cover 108.

Any number or variety of components in any of the configurationsdescribed herein can be included in an electronic device, as describedherein. The components can include any combination of the featuresdescribed herein, and can be arranged in any of the variousconfigurations described herein. The structure and arrangement ofcomponents of a device, as well as the concepts regarding their use canapply not only to the specific examples discussed herein, but to anynumber of embodiments in any combination. Various examples of electronicdevices and electronic device components including some having variousfeatures in various arrangements are described below, with reference toFIGS. 2-4 .

FIG. 2 shows an exploded view of a display assembly 200 that can besubstantially similar to, and can include some or all of the features ofthe display assembly 120. For example, the display assembly 200 caninclude a display panel 202, a printed circuit board (PCB) 204, asupport structure 206, and one or more intermediate layers. The displaypanel 202 can include a liquid crystal display (LCD), a light emittingdiode (LED) display, an organic light emitting diode (OLED) display,and/or any other form of display technology. The display panel 202 canbe electrically coupled to the PCB 204 such that signals, electricalpower, and/or electrical ground can be passed or formed between thedisplay panel 202 and the PCB 204. In other words, the PCB 204 caninclude one or more electronic components and/or electrical circuitswhich enable operation of the display panel 202. As such, the PCB 204can be electrically coupled to the display panel 202, for example, by aflexible electrical conduit (see FIGS. 6A and 6B).

In some examples, the support structure 206 can include a polyethyleneterephthalate (PET) back film or other polyester based film providing arigid structure that supports the display panel 202 in a fixed andplanar position. In examples, like the example shown in FIG. 2 , thesupport structure 206 has a thickness of about 100 microns, betweenabout 100 microns and about 75 microns, between about 75 microns andabout 50 microns, between about 50 microns and about 25 microns, or lessthan about 25 microns. The support structure 206 can be affixed to thedisplay panel 202 by an adhesive layer 208, for example, a pressuresensitive adhesive (PSA) tape.

One or more of the intermediate layers of the display assembly 200(i.e., layers between the PCB 204 and display panel 202) can be part ofan antenna (e.g., an antenna coil for an NFC antenna, Wi-Fi antenna, UWBantenna, GPS antenna, or other antenna). For example, the displayassembly 200 can include an antenna coil 210 disposed between apolyimide (PI) film 212 and an adhesive layer 214. The antenna coil 210can include metal and act as a radiating element which propagateselectromagnetic waves for the antenna. The PI film 212 can have arelatively low permittivity to minimize loss of electromagnetic wavesradiated by the antenna coil 210. In some examples, the PI film 212 canhave a thickness of about 10 microns and the adhesive layer 214 can havea thickness of about 5 microns. In some examples, the PI film 212 can beaffixed to the support structure 206 by an adhesive layer 216 having athickness of about 50 microns.

In some examples, one or more layers can be disposed between the antennacoil 210 and the PCB 204 to limit electromagnetic waves from directlypropagating from the antenna coil 210 to the PCB 204. In other words,the display assembly 200 can include one or more layers which shield thePCB 204 from electromagnetic waves generated by the antenna coil 210.For example, the display assembly 200 can include a ferrite layer 218and another PI film 220 disposed between the adhesive layer 214 and thePCB 204. The ferrite layer 218 can be about 90 microns thick and canblock or mitigate electromagnetic interference on the PCB 204 by theantenna coil 210. The PI film 220 can have a thickness of about 10microns and have a relatively low permittivity to insulate the PCB 204from electromagnetic waves radiated by the antenna coil 210. The PCB 204can be affixed to the PI film 220 by an adhesive layer 222 (e.g., a PSAtape) having a thickness of about 30 microns.

In some examples, the display panel 202 can operate as a display as welloperating as an antenna radiating element. For example, electromagneticwaves generated by the antenna coil 210 can be further propagated by thedisplay panel 202. However, by radiating electromagnetic waves, thedisplay panel 202 can induce a capacitive charge on the PCB 204 andeffectively cause the display assembly 200 to act as a capacitor (i.e.,the PCB 204 and the display panel 202 can act as capactively chargedplates of a capacitor). The capacitive charge induced on the PCB 204 candiminish or degrade antenna performance.

FIG. 3 shows a display assembly 300 that can be substantially similarto, and can include some or all of the features of the displayassemblies 120, 200. For example, the display assembly 300 can include adisplay panel 302, a printed circuit board (PCB) 304, and one or moreintermediate layers 306. The one or more intermediate layers 306 caninclude any of the layers or components described with reference to thedisplay assembly 200 shown in FIG. 2 . For example, the one or moreintermediate layers can include one or more adhesive layers, ferritelayers, PI layers, antenna coils, and/or support structures. The one ormore intermediate layers 306 can displace the PCB 304 from the displaypanel 302 by a distance d which relates to a combined thickness of theone or more intermediate layers 306. In examples, the distance d betweenthe PCB 304 and the display panel 302 can correlate to an amount ofcapacitive loss or degradation in antenna performance when radiation ofthe antenna signals by the display panel 302 induces a capacitive chargeon the PCB 304. In some examples, by reducing the distance d between thecapacitively coupled components of the display assembly, losses inantenna performance resultant from capacitive coupling within thedisplay assembly can be mitigated.

FIG. 4 shows an example of display assembly 400 which is modified toreduce the distance d and mitigate this loss in antenna performance.More specifically, FIG. 4 shows an exploded view of the display assembly400 that can be substantially similar to, and can include some or all ofthe features of the display assemblies 120, 200, 300. For example, thedisplay assembly 400 can include a display panel 402, a printed circuitboard (PCB) 404, and one or more intermediate layers. The displayassembly 400 shown in FIG. 4 can be devoid of the PET back film-basedsupport structure (support structure 206) shown in FIG. 2 . Rather, thedisplay assembly 400 can include a support structure 406 which not onlyprovides a rigid structure that supports the display panel 402 in afixed and planar position, but also has other functional use. Forexample, one or more antenna components (e.g., antenna coil 408) can beformed within or otherwise deposited on the support structure 406.Additionally, or alternatively, the support structure 406 can includeone or more other electrically conductive elements 407 formed within orotherwise disposed on the support structure 406, such as, electricaltraces within the support structure 406 or otherwise deposited on asurface of the support structure 406 to provide electrical paths throughthe display assembly 400. In other words, in addition to providing arigid support for the display panel 402, the support structure 406 canhave additional functionality beyond the simple utility of the PET backfilm (support structure 206) shown in FIG. 2 .

In some examples, the one or more electrically conductive elements 407can be one or more sensors, electrical traces, electrical circuits, acombination thereof, or any other electronic component. In someexamples, the support structure 406 can be made from a glass or a wovenglass reinforced epoxy resin, like a PCB, which includes electricaltraces or circuits that enable input detection at the display panel 402(e.g., circuits which enable touch or near-touch detection at a surfaceof the display panel 402). In examples wherein the one or moreelectrically conductive elements 407 include a sensor, the sensor can beany sensor applicable to operation of an electronic device, such as, anambient light sensor, a pressure sensor, an acoustic sensor, acapacitance sensor, a combination thereof, or any other sensor.

In some examples, the support structure 406 can be manufactured as asecond PCB of the display assembly 400, wherein the PCB 404 is the firstPCB of the display assembly 400. For example, the support structure 406can be manufactured having an FR4 core or other material used tomanufacture printed circuit boards. The support structure 406 can beless thick than the PET back film making up the support structure 206shown in FIG. 2 . For example, the support structure 406 can have athickness of about 75 microns, between about 75 microns and about 50microns, between about 50 microns and about 25 microns, or less thanabout 25 microns. Because the display assembly 400 lacks a PET back filmand the support structure 406 is relatively thinner than the supportstructure 206 described above with reference to FIG. 2 , the distancebetween the PCB 404 and the display panel 402 (shown as distance d inFIG. 3 ) can be reduced to lessen or mitigate the undesirable losses inantenna performance described herein. In short, the support structure406 can have multifunctional use and reduce the thickness of theintermediate layers (i.e., distance d) within the display assembly 400.

In some examples, the antenna coil 408 can be disposed between thesupport structure 406 and a layer 410. The support structure 406, theantenna coil 408, and the layer 410 can be disposed between respectivelayers of dry film 412, 414 and affixed to the display panel 402 by anadhesive layer 416, for example, a pressure sensitive adhesive (PSA)tape. In some examples, one or more layers can be disposed between thedry film 412 and the PCB 404 to limit electromagnetic waves fromdirectly propagating from the antenna coil 408 to the PCB 404. Forexample, the display assembly 400 can include a ferrite layer 418affixed to the PCB 404 by an adhesive layer 420 (e.g., PSA tape). Theferrite layer 418 can be about 90 microns thick and can block ormitigate electromagnetic interference on the PCB 404 by the antenna coil408. The adhesive layer 420 can have a thickness of about 30 microns.The ferrite layer 418 can be affixed to the dry film 412 by an adhesivelayer 422 (e.g., PSA tape) having a thickness of about 5 microns. Thethickness of the intermediate layers between the PCB 404 and the displaypanel 402 can be less than about 300 microns, between 300 microns andabout 250 microns, between about 250 microns and about 225 microns, orless than 225 microns. As such, the total thickness of the displayassembly 400 can be reduced, for example to about 800 microns, betweenabout 800 microns and about 700 microns, between about 700 microns andabout 600 microns, between about 600 microns and about 500 microns,between about 500 microns and about 400 microns, or less than 400microns.

While the display assembly 400 is shown in FIG. 4 as having a particularconfiguration of intermediate layers (e.g., quantity, type, arrangement,thickness, etc.), the configuration of the intermediate layers can bevaried in other examples such that the display assembly has fewer,additional, different, or modified intermediate layers. For example, thethickness of one or more of the intermediate layers can vary from oneexample to another example. Additionally, or alternatively, the type oflayer or material of a particular layer can be substituted for any otherlayer or material commonly used to generate display assemblies forelectronic devices. For example, in some examples, the display assembly400 can further include a polyester based film (e.g., a PET back film)disposed between the display panel 402 and the support structure 406.The polyester based film can operate in tandem with the supportstructure 406 to provide a uniform and rigid surface for mounting thedisplay panel 402.

Any number or variety of components in any of the configurationsdescribed herein can be included in an electronic device, as describedherein. The components can include any combination of the featuresdescribed herein, and can be arranged in any of the variousconfigurations described herein. The structure and arrangement ofcomponents of a device, as well as the concepts regarding their use canapply not only to the specific examples discussed herein, but to anynumber of embodiments in any combination. Various examples of electronicdevices and electronic device components including some having variousfeatures in various arrangements are described below, with reference toFIGS. 5A-5B.

FIG. 5A shows a display assembly 500 in a first configuration duringassembly and FIG. 5B shows the display assembly 500 in a secondconfiguration during assembly. The display assembly 500 can besubstantially similar to, and can include some or all of the features ofthe display assemblies 120, 200, 300, 400. For example, the displayassembly 500 can include a display panel 502, a printed circuit board(PCB) 504, a support structure 506, and one or more intermediate layers.The PCB 504 can include one or more electronic components 508A, 508B,508C, 508D electrically coupled to the PCB 504 and configured to enableoperation of the display assembly 500. For example, one or more of theelectronic components 508A-D can be signal generators, sensors, powersupplies, a central processing unit, receivers, transmitters,transceivers, antennas, antenna components, random-access memory, flashmemory, serial buses, input/output ports, digital logic circuitry,display control circuitry, combinations thereof, or any other electroniccomponent.

In some examples, a flexible electrical conduit 510 can be affixedbetween the PCB 504 and one or both of the display panel 502 and thesupport structure 506. The flexible electrical conduit 510 can form oneor more electrical pathways between the PCB 504, the display panel 502,and/or the support structure 506. For example, one or more of controlsignals, electrical power, and/or electrical ground can be carried orotherwise formed by the flexible electrical conduit 510. In someexamples, the support structure 506 can include one or more electricaltraces electrically coupled to the flexible electrical conduit 510. Insome examples, the one or more electrical traces can form electricalcircuits within the support structure 506 and the flexible electricalconduit 510 can provide control signals, electrical power, and/or agrounding path to the electrical circuits.

In some examples, the width of the flexible electrical conduit 510 cancorrelate to the quantity of electrical traces and circuits disposedwithin or on the support structure 506. For example, a display assemblyhaving a support structure that only provides a rigid support for thedisplay panel (as described in FIG. 2 ) can require a wider flexibleelectrical conduit to provide all of the signals, electrical power, andground required to operate the display panel. Alternatively, a displayassembly having a support structure that also provides electricalfunctionality (as described in FIG. 4 ) can require a relatively lesswide flexible electrical conduit because one or more of the signalsrequired to operate the display panel can be generated at or passedthrough the support structure, rather than all of the signals beinggenerated at the PCB 504 and passed through the flexible electricalconduit 510. A relatively smaller (e.g., more narrow) flexibleelectrical conduit 510 can maximize the available space or volume in aninternal volume defined by a housing of a device (e.g., electronicdevice 100) or otherwise enable the overall dimensions of the device tobe reduced.

In the first orientation, one or more intermediate layers (e.g., theintermediate layers described herein and referenced in FIGS. 2-4 ) canbe adhered, assembled, or otherwise affixed to the support structure 506or the PCB 504. Thereafter, in the second configuration, the flexibleelectrical conduit 510 can be folded and the PCB 504, or one or moreintermediate layers affixed beneath the PCB 504, can be adhered orotherwise affixed to the support structure 506. In some examples, one ormore electrical contacts of the PCB 504 can be electrically coupled tothe support structure 506 through one or more electrical couplers (seeFIGS. 6A-7C), rather than relying on the flexible electrical conduit510.

Any number or variety of components in any of the configurationsdescribed herein can be included in an electronic device, as describedherein. The components can include any combination of the featuresdescribed herein, and can be arranged in any of the variousconfigurations described herein. The structure and arrangement ofcomponents of a device, as well as the concepts regarding their use canapply not only to the specific examples discussed herein, but to anynumber of embodiments in any combination. Various examples of electronicdevices and electronic device components including some having variousfeatures in various arrangements are described below, with reference toFIGS. 6A-6B.

In some examples, electrically coupling a PCB (e.g., a PCB for a displayassembly) and another component like a secondary PCB (e.g., a supportstructure of the display assembly) can be desirable to electricallytether the two PCBs. For example, as described herein, radiation ofelectromagnetic waves by the display panel can induce a capacitivecharge on the first PCB and diminish antenna performance, yet thisinduced capacitive charge can be limited or prevented by electricallytethering the first PCB to the secondary PCB. FIG. 6A shows a detailview of a display assembly 600. The display assembly 600 can besubstantially similar to, and can include some or all of the features ofthe display assemblies 120, 200, 300, 400, 500. For example, the displayassembly 600 can include a printed circuit board (PCB) 602, a supportstructure 604, and one or more intermediate layers. In some examples,the support structure 604 can include one or more antenna components(e.g., antenna coil 408) or one or more electronic components (e.g.,electrically conductive elements 407), such as, electrical traces withinthe support structure 604 or otherwise deposited on a surface of thesupport structure 604 to provide electrical paths through the displayassembly 600.

In some examples, the PCB 602 and the support structure 604 can bephysically and electrically tethered or joined by one or more electricalcouplers 606. Each of the one or more electrical couplers 606 can be atleast partially formed using an electrically conductive material, suchas, a metal or metal alloy. In examples, the electrical coupler 606 caninclude a proximal end 608 conductively connected to the PCB 602 and adistal end 610 conductively connected to the support structure 604and/or an electronic component within or on the support structure 604.For example, the proximal end 608 can be physically and electricallyattached to a metal pad 612 or other conductive element on the PCB 602.In some examples, the proximal end 608 can be attached by asurface-mount technology (SMT) assembly process including soldering. Theproximal end 608 and the distal end 610 can be interconnected by anintermediate portion 614. The electrical coupler 606 can be stamped,machined, molded, or otherwise formed from a single piece of material insome examples. In other examples, each of the proximal end 608, thedistal end 610, and the intermediate portion 614 can be distinctcomponents which are fastened, welded, adhered, or otherwise joined toform the electrical coupler 606.

The distal end 610 can be disposed over a metal pad 616 or otherconductive element on the support structure 604. In some examples, thedistal end 610 and the metal pad 616 can form a gap G (see FIG. 6B). Thegap G can be at least partially filled with solder or anotherelectrically conductive material to physically and electrically attachthe distal end 610 to the support structure 604. The gap G can provideclearance to accommodate tolerance variances in thicknesses of thevarious layers and components making up the display assembly 600. Forexample, the size of the gap G can vary depending on the thickness ofthe PCB 602. In some examples, the size of the gap G can be less than orequal to a diameter of a solder ball (not shown) melted to affix thedistal end 610 to the metal pad 616. For example, the gap G can be about100 microns, between about 100 microns and about 75 microns, betweenabout 75 microns, and about 50 microns, or less than 50 microns. In someexamples, the proximal end 608 and the distal end 610 can extendparallel to one another and be vertically offset or displaced by theintermediate portion 614. In some examples, the distal end 610 can forma scallop or cutout 618 which provides a lengthened edge or lip andadditional surface area for solder to overlap when the distal end 610 issoldered to the metal pad 616 of the support structure 604.

In some examples, the display assembly 600 can include one or moreintermediate layers. For example, the PCB 602 can be affixed to aferrite layer 620 by an adhesive layer 622, such as, a PSA tape. Theferrite layer 620 can be affixed to the support structure 604 by anadhesive layer 624, such as, a PSA tape. The support structure 604 canbe affixed to a display panel 626 by an adhesive layer 628, such as, aPSA tape. While the display assembly 600 is shown in FIG. 6B as having aparticular configuration of intermediate layers (e.g., quantity, type,arrangement, thickness, etc.), the configuration of the intermediatelayers can be varied in other examples such that the display assemblyhas fewer, additional, different, or modified intermediate layers. Forexample, the thickness of one or more of the intermediate layers canvary from one example to another example. Additionally, oralternatively, the type of layer or material of a particular layer canbe substituted for any other layer or material commonly used to generatedisplay assemblies for electronic devices.

Any number or variety of components in any of the configurationsdescribed herein can be included in an electronic device, as describedherein. The components can include any combination of the featuresdescribed herein, and can be arranged in any of the variousconfigurations described herein. The structure and arrangement ofcomponents of a device, as well as the concepts regarding their use canapply not only to the specific examples discussed herein, but to anynumber of embodiments in any combination. Various examples of electronicdevices and electronic device components including some having variousfeatures in various arrangements are described below, with reference toFIGS. 7A-7C.

FIG. 7A shows a detail view of a display assembly 700. The displayassembly 700 can be substantially similar to, and can include some orall of the features of the display assemblies 120, 200, 300, 400, 500,600. For example, the display assembly 700 can include a printed circuitboard (PCB) 702, a support structure 704, and one or more intermediatelayers (see FIG. 7B). In some examples, the support structure 704 caninclude one or more antenna components (e.g., antenna coil 408) or oneor more electronic components (e.g., electrically conductive elements407), such as, electrical traces within the support structure 704 orotherwise deposited on a surface of the support structure 704 to provideelectrical paths through the display assembly 700.

In some examples, the PCB 702 and the support structure 704 can bephysically and electrically tethered or joined by one or more electricalcouplers 706. The one or more electrical couplers 706 can each be atleast partially formed using an electrically conductive material, suchas, a metal or metal alloy. As shown in the cross-sectional side viewillustrated in FIG. 7B, the electrical coupler 706 can include a body708 defining a channel 710 therein. While the body 708 and the channel710 are depicted as cylindrical in FIGS. 7A and 7B, in other examples,the body 708 and/or channel 710 can be defined by any geometric shapesuch as cubic, triangular, ellipsoidal, a combination thereof, or anyother geometric shape.

In examples, the electrical coupler 706 can include a flange 712extending laterally around a periphery of the body 708. The flange 712can abut a metal pad 714 or other electrical contact on the PCB 702. Insome examples, the flange 712 can be attached by a surface-mounttechnology (SMT) assembly process including soldering. In examples, theelectrical coupler 706 can extend through an aperture formed within thePCB 702 and at least partially extend into a recess formed within thesupport structure 704 (see FIG. 7B). The body 708 and the supportstructure 704 can form a gap G. The gap G can be a distance or offsetbetween the body 708 and a metal pad 716 disposed within the recess ofthe support structure 704. In some examples, a solder ball can beinserted into the channel 710 and subsequently melted to bridge the gapG and electrically attach the electrical coupler 706 to the supportstructure 704. The metal pads 714, 716 can be electrically coupled toone or more electrical components, electrical traces, electricalcircuits, or combinations thereof on or within the PCB 702 and/or thesupport structure 704.

In some examples, the gap G can be at least partially filled with solderor another electrically conductive material to physically andelectrically attach the body 708 to the support structure 704. The gap Gcan provide clearance to accommodate tolerance variances in thicknessesof the various layers and components making up the display assembly 700.For example, the size of the gap G can vary depending on the thicknessof the PCB 702. In some examples, the size of the gap G can be less thanor equal to a diameter of a solder ball (not shown) melted to affix thebody 708 to the metal pad 716. For example, the gap G can be about 100microns, between about 100 microns and about 75 microns, between about75 microns, and about 50 microns, or less than 50 microns.

In some examples, the display assembly can include one or moreintermediate layers. For example, the PCB 702 can be affixed to aferrite layer 718 by an adhesive layer 720, such as, a PSA tape. In someexamples, one or more of the intermediate layers can define an apertureto enable the electrical coupler 706 to extend into the recess definedby the support structure 704. For example, the ferrite layer 718 and theadhesive layer 720 can each define an aperture aligned with the apertureof the PCB 702. The ferrite layer 718 can be affixed to the supportstructure 704 by an adhesive layer 722, such as, a PSA tape. The supportstructure 704 can be affixed to a display panel 724 by an adhesive layer726, such as, a PSA tape. While the display assembly 700 is shown inFIG. 7B as having a particular configuration of intermediate layers(e.g., quantity, type, arrangement, thickness, etc.), the configurationof the intermediate layers can be varied in other examples such that thedisplay assembly has fewer, additional, different, or modifiedintermediate layers. For example, the thickness of one or more of theintermediate layers can vary from one example to another example.Additionally, or alternatively, the type of layer or material of aparticular layer can be substituted for any other layer or materialcommonly used to generate display assemblies for electronic devices.

FIG. 7C shows the support structure 704 of the display assembly 700including an electrically conductive element 728. The electricallyconductive element 728 can be deposited, formed, or otherwise adhered toa surface of the support structure 704 in some examples. Additionally,or alternatively, one or more electrically conductive elements 728 canbe formed or defined within the support structure 704 (e.g., formed asone or more metallic traces at least partially positioned within thesupport structure 704). While the electrically conductive element 728 isdepicted as an antenna coil, the electrically conductive element 728 canadditionally, or alternatively, include one or more electrical traces,electrical circuits, sensors, a combination thereof, or any otherelectronic component. In examples, the first electrical coupler 706A andthe second electrical coupler 706B can also be electrically andphysically attached to the PCB 702 (not shown in FIG. 7C). Theelectrically conductive element 728 can be electrically and physicallyattached to a first electrical coupler 706A and a second electricalcoupler 706B. The first and second electrical couplers 706A, 706B caneach individually or collectively provide control signals, electricalpower, and/or a grounding path to the electrically conductive element728.

To the extent applicable to the present technology, gathering and use ofdata available from various sources can be used to improve the deliveryto users of invitational content or any other content that may be ofinterest to them. The present disclosure contemplates that in someinstances, this gathered data may include personal information data thatuniquely identifies or can be used to contact or locate a specificperson. Such personal information data can include demographic data,location-based data, telephone numbers, email addresses, TWITTER® ID's,home addresses, data or records relating to a user's health or level offitness (e.g., vital signs measurements, medication information,exercise information), date of birth, or any other identifying orpersonal information.

The present disclosure recognizes that the use of such personalinformation data, in the present technology, can be used to the benefitof users. For example, the personal information data can be used todeliver targeted content that is of greater interest to the user.Accordingly, use of such personal information data enables users tocalculated control of the delivered content. Further, other uses forpersonal information data that benefit the user are also contemplated bythe present disclosure. For instance, health and fitness data may beused to provide insights into a user's general wellness, or may be usedas positive feedback to individuals using technology to pursue wellnessgoals.

The present disclosure contemplates that the entities responsible forthe collection, analysis, disclosure, transfer, storage, or other use ofsuch personal information data will comply with well-established privacypolicies and/or privacy practices. In particular, such entities shouldimplement and consistently use privacy policies and practices that aregenerally recognized as meeting or exceeding industry or governmentalrequirements for maintaining personal information data private andsecure. Such policies should be easily accessible by users, and shouldbe updated as the collection and/or use of data changes. Personalinformation from users should be collected for legitimate and reasonableuses of the entity and not shared or sold outside of those legitimateuses. Further, such collection/sharing should occur after receiving theinformed consent of the users. Additionally, such entities shouldconsider taking any needed steps for safeguarding and securing access tosuch personal information data and ensuring that others with access tothe personal information data adhere to their privacy policies andprocedures. Further, such entities can subject themselves to evaluationby third parties to certify their adherence to widely accepted privacypolicies and practices. In addition, policies and practices should beadapted for the particular types of personal information data beingcollected and/or accessed and adapted to applicable laws and standards,including jurisdiction-specific considerations. For instance, in the US,collection of or access to certain health data may be governed byfederal and/or state laws, such as the Health Insurance Portability andAccountability Act (HIPAA); whereas health data in other countries maybe subject to other regulations and policies and should be handledaccordingly. Hence different privacy practices should be maintained fordifferent personal data types in each country.

Despite the foregoing, the present disclosure also contemplatesembodiments in which users selectively block the use of, or access to,personal information data. That is, the present disclosure contemplatesthat hardware and/or software elements can be provided to prevent orblock access to such personal information data. For example, in the caseof advertisement delivery services, the present technology can beconfigured to allow users to select to “opt in” or “opt out” ofparticipation in the collection of personal information data duringregistration for services or anytime thereafter. In another example,users can select not to provide mood-associated data for targetedcontent delivery services. In yet another example, users can select tolimit the length of time mood-associated data is maintained or entirelyprohibit the development of a baseline mood profile. In addition toproviding “opt in” and “opt out” options, the present disclosurecontemplates providing notifications relating to the access or use ofpersonal information. For instance, a user may be notified upondownloading an app that their personal information data will be accessedand then reminded again just before personal information data isaccessed by the app.

Moreover, it is the intent of the present disclosure that personalinformation data should be managed and handled in a way to minimizerisks of unintentional or unauthorized access or use. Risk can beminimized by limiting the collection of data and deleting data once itis no longer needed. In addition, and when applicable, including incertain health related applications, data de-identification can be usedto protect a user's privacy. De-identification may be facilitated, whenappropriate, by removing specific identifiers (e.g., date of birth,etc.), controlling the amount or specificity of data stored (e.g.,collecting location data a city level rather than at an address level),controlling how data is stored (e.g., aggregating data across users),and/or other methods.

Therefore, although the present disclosure broadly covers use ofpersonal information data to implement one or more various disclosedembodiments, the present disclosure also contemplates that the variousembodiments can also be implemented without the need for accessing suchpersonal information data. That is, the various embodiments of thepresent technology are not rendered inoperable due to the lack of all ora portion of such personal information data. For example, content can beselected and delivered to users by inferring preferences based onnon-personal information data or a bare minimum amount of personalinformation, such as the content being requested by the deviceassociated with a user, other non-personal information available to thecontent delivery services, or publicly available information.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not target to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. A display assembly for an electronic device,comprising: a printed circuit board; a display panel electricallycoupled to the printed circuit board; a support structure affixed to thedisplay panel and disposed between the printed circuit board and thedisplay panel, the support structure having an electrically conductiveelement; and a coupler electrically connecting the printed circuit boardand the support structure, the coupler comprising: a body defining achannel extending through the body, the body extending through anaperture formed within the printed circuit board; and a flange extendinglaterally from the body.
 2. The display assembly of claim 1, wherein theelectrically conductive element is part of an antenna.
 3. The displayassembly of claim 1, wherein: the printed circuit board comprises afirst printed circuit board; and the support structure comprises asecond printed circuit board.
 4. The display assembly of claim 1,wherein: the support structure comprises glass; and the electricallyconductive element includes metallic traces.
 5. The display assembly ofclaim 1, wherein the display panel and the printed circuit board areseparated by less than about 300 microns.
 6. The display assembly ofclaim 1, wherein the display panel comprises either an organiclight-emitting diode (OLED) or a micro light emitting diode (LED). 7.The display assembly of claim 1, wherein the electrically conductiveelement is electrically coupled to the display panel or the printedcircuit board.
 8. The display assembly of claim 1, further comprising aferrite layer disposed between the printed circuit board and the supportstructure.
 9. The display assembly of claim 1, further comprising apolyester-based film disposed between the display panel and the supportstructure.
 10. The display assembly of claim 9, wherein thepolyester-based film has a thickness of less than about 50 microns. 11.A display assembly for an electronic device, comprising: a printedcircuit board; a display panel electrically coupled to the printedcircuit board; a support structure disposed between the printed circuitboard and the display panel; an antenna disposed between the printedcircuit board and the display panel; wherein the printed circuit boardis displaced from the display panel a distance of less than about 300microns.
 12. The display assembly of claim 11, wherein the supportstructure has a thickness of less than about 50 microns.
 13. The displayassembly of claim 11, further comprising an intermediate layer disposedbetween the printed circuit board and the support structure, theintermediate layer comprising ferrite.
 14. The display assembly of claim11, wherein the display assembly has a thickness of less than about 800microns.
 15. The display assembly of claim 11, wherein the supportstructure comprises a woven glass reinforced epoxy resin.
 16. Thedisplay assembly of claim 11, the support structure further comprisingan electrically conductive trace.
 17. A display assembly for anelectronic device, comprising: a printed circuit board; a display panelelectrically coupled to the printed circuit board; a support structuredisposed between the printed circuit board and the display panel; and anelectrical coupler conductively connecting the printed circuit board andthe support structure, wherein the electrical coupler comprises: aproximal end conductively connected to the printed circuit board; adistal end displaced from the proximal end, the distal end conductivelyconnected to the support structure; and an intermediate portionextending between the proximal end and the distal end.
 18. The displayassembly of claim 17, further comprising solder disposed in a gapbetween the distal end and the support structure.